HyperRam™ & Octal xSPI RAM | サイプレス セミコンダクタ
HyperRam™ & Octal xSPI RAM
HyperRAM™ is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HyperRAM™ offers JEDEC compliant HyperBus™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories, while enhancing system performance and ease of design, as well as reducing system cost. HyperRAM the ideal scratchpad/buffering off-chip memory for controllers with limited on-board RAM such as automotive instrument clusters, industrial HMI, industrial machine vision and display systems for consumer electronics.
HyperRAM™ | Octal xSPI RAM | ||
Family Series | Gen 1.0 | KL-1/KS-1 | Gen 2.0 | KL-2/KS-2 | KL-3/KS-3 |
インターフェース | X8 HyperBus | x8 HyperBus | x8 Octal xSPI |
Density | 64Mb, 128Mb |
64Mb, 128Mb, 256Mb (New!), 512Mb (New!) |
64Mb, 128Mb, 256Mb (New!), 512Mb (New!) |
Throughput | 333 MBps | 400 MBps | 400 MBps |
パッケージ | 48 mm2, 24-ball BGA | 48 mm2, 24-ball BGA | 48 mm2, 24-ball BGA |
製品セレクタ ガイド | ![]() |
![]() |
![]() |
HyperBus utilizes a high-speed 8-bit DDR interface for both address and data. In addition, it uses a differential clock, a read/write latch signal, and a chip select for each memory device. HyperBus supports external flash and RAM on the same bus, and works with any microcontroller with a HyperBus compatible peripheral interface.
For more details on how the HyperRAM™ provides a low-pin expansion memory solution, read this whitepaper.
Small Form Factor
Low Pin-Count
低出力
High Throughput
Learn about Infineon Products
- Watch the Introduction to HyperRAM™ 2.0 video
- Read:
- Get and overview of the product features
- Understand the product applications
- Download the Datasheets for:
- Octal xSPI RAM
- HyperRAM™ 2.0
- Read:
- Application Note: Getting started with HyperRAM2.0
- Application Note: Migrating from HyperRAM1.0 to HyperRAM2.0
- Use the Product Selector to select the appropriate product
- Order your sample
- Get your schematics reviewed by the Cypress Applications Engineering Team using Cypress Developer Community
特徴 | HyperRAM™ 1.0 (KL-1/KS-1) | HyperRAM™ 2.0 (KL-2/KS-2) | Octal xSPI RAM (KL-3/KS-3) |
製品セレクタ ガイド | |||
Density | 64Mb, 128Mb | 64Mb, 128Mb, 256Mb, 512Mb | 64Mb, 128Mb, 256Mb, 512Mb |
Operating Voltage |
1.8V 3.0V |
1.8V 3.0V (only 64Mb, 128Mb) |
1.8V 3.0V (only 64Mb, 128Mb) |
インターフェース |
HyperBus (JEDEC JESD251 Profile 2.0) |
HyperBus (JEDEC JESD251 Profile 2.0) |
Octal xSPI (JEDEC JESD251 Profile 1.0) |
Data Bus Width | 8-bit (x8) | 8-bit (x8) | 8-bit (x8) |
Frequency, Throughput | 200 Mhz, 400 MBps | 200 MHz, 400 MBps | |
使用温度範囲 |
Industrial, -40°C to +85°C Industrial Plus, -40°C to 105°C Automotive Grade 3, -40°C to 85°C Automotive Grade 2, -40°C to +105°C |
Industrial, -40°C to +85°C Industrial Plus, -40°C to 105°C Automotive Grade 3, -40°C to 85°C Automotive Grade 2, -40°C to +105°C Automotive Grade 1, -40°C to +125°C |
Industrial, -40°C to +85°C Industrial Plus, -40°C to 105°C Automotive Grade 3, -40°C to 85°C Automotive Grade 2, -40°C to +105°C |
Packages | 48mm2, 24-ball BGA | 48mm2, 24-ball BGA | 48mm2, 24-ball BGA |
Active Current (max) | 60 mA (1.8V), 35 mA (3.0V) | 25 mA (1.8V), 30 mA (3.0V) | 25 mA (1.8V), 30 mA (3.0V) |
Standby Current (max) | 200 μA (1.8V), 300 μA (3.0V) | 220 μA (1.8V), 250 μA (3.0V) | 220 μA (1.8V), 250 μA (3.0V) |
Deep Power Down (Max No Refresh Current) | 10 μA (1.8V), 20 μA (3.0V) | 10 μA (1.8V), 12 μA (3.0V) | 10 μA (1.8V), 12 μA (3.0V) |
Hybrid Sleep (Typ. Self Refresh Current) | NA | 25 μA (1.8V), 35 μA (3.0V) | 25 μA (1.8V), 35 μA (3.0V) |
Partial Array Refresh | はい | はい | はい |
データシート |
1. Automotive Instrument Cluster
Click here to learn about other Cypress’ solutions for Automotive Instrument Clusters.
Design Challenges
- Limited internal video RAM on MCU
- Requires memory to support fast bus speeds for smooth graphics rendering
- Requires high-reliability low complexity interface
- Requires automotive qualified memory
Cypress Solution
- 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity of mid- and high-end clusters
- Offers 400 MBps read speed for 1.8 V and 3.0 V versions
- HyperRAM™ offers simple 12-pin bus that is shareable with HyperFlash™
- HyperRAM comes in Automotive Grade 2 temperature grade
2. Displays: Consumer and Industrial HMI
Design Challenges
- Limited internal RAM resources on MCU
- Small footprint and low pin-count memory
- Support fast bus speeds for smooth graphics rendering
Cypress Solution
- 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity in displays
- Tiny 48 mm2 (6 mm x 8 mm) 24-pin package with 12 signal pins
- Offers 400 MBps read speed at 1.8 V
3. Industrial Machine Vision Camera
Design Challenges
- Limited internal RAM resources on FPGA
- Low pin-count external memory required
- 400-MBps throughput requireent
- Gate-count efficient IP for external memory interface
Cypress Solution
- 64Mb -512Mb density options that meet expansion RAM needs
- 24-Pin package with 12 signal pins
- 400-MBps read speed at 1.8 V
- Availability of optimized IP for leading FPGA platforms
Document Type | Product | タイトル | 英語 | 中国語 | 日本語 |
---|---|---|---|---|---|
データシート | HyperRAM™ 2.0 | ![]() |
- | - | |
![]() |
- | - | |||
![]() |
- | - | |||
![]() |
- | - | |||
Octal xSPI RAM | ![]() |
- | - | ||
![]() |
- | - | |||
![]() |
- | - | |||
![]() |
- | - | |||
アプリケーション ノート | HyperRAM™ | ![]() |
- | - | |
AN226137 - Migrating from S27KL0641/S27KS0641 to S27KL0642/S27KS0642 |
![]() |
- | - | ||
モデル | HyperRAM | ![]() |
- | - | |
Octal xSPI RAM | ![]() |
- | - | ||
Specification | HyperBus | ![]() |
- | - | |
Whitepaper |
HyperRAM™/ Octal xSPI RAM |
![]() |
- | - | |
Brochure | ![]() |
- | - | ||
Roadmap | ![]() |
- | - |