S29GL256S90TFA023 | サイプレス セミコンダクタ
S29GL256S90TFA023
| 車載用認定済み | あり |
| Density (Mbit) | 256 |
| Initial Access Time (ns) | 90 |
| インターフェース | Parallel |
| Interface Frequency (SDR / DDR) (MHz) | NA |
| 最大動作電圧（V) | 3.60 |
| 最小動作電圧（V） | 2.70 |
| Operating Voltage (V) | 3 |
| Page Access Time (ns) | 15 |
| Part Family | Parallel NOR |
| Series | GL-S |
| Tape & Reel | あり |
| Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.99 | $6.72 | $5.99 | $5.26 | $4.97 | $4.65 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Matte Tin Plating
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2017年5月16日
技術文書
アプリケーション ノート (25)
2020 年 6 月 03 日
製品変更通知（PCN）（2）
2020年4月23日
Addendum to PCN#165004: Introduction of Die Overcoat for Automotive NOR Flash Memory Products
2020年4月14日
Qualification of XMC as an Additional Wafer Fab Site for Automotive GL-S NOR Flash Memory Products
Advanced Product Change Notice (APCN) (9)
2020年4月23日
Addendum to APCN181801 - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family
2020年4月14日
Addendum to Advance PCN181801A - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family
Product Information Notice (PIN) (1)
2020年4月14日
Qualification of WXIC, China as an Additional Wafer Foundry Site for 65nm GL-S MirrorBit® Eclipse Flash Memory Products
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