S29GL064S80TFV040 | サイプレス セミコンダクタ
S29GL064S80TFV040
車載用認定済み | N |
Density (Mbit) | 64 |
Initial Access Time (ns) | 80 |
インターフェース | Parallel |
Interface Frequency (SDR / DDR) (MHz) | NA |
最大動作温度(°C) | 105 |
最大動作電圧(V) | 3.60 |
最小動作温度(°C) | -40 |
最小動作電圧(V) | 2.70 |
Operating Voltage (V) | 3 |
Page Access Time (ns) | 15 |
Part Family | Parallel NOR |
Series | GL-S |
Tape & Reel | N |
Temperature Range (Min C to Max C) | -40C to +105C |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$4.31 | $3.63 | $3.23 | $2.84 | $2.69 | $2.51 |
Packaging/Ordering
パッケージ
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
168
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
あり
鉛フリー
あり
Lead/Ball Finish
Matte Tin Plating
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2018 年 10 月 10 日
技術文書
アプリケーション ノート (25)
2021 年 3 月 03 日
2021 年 3 月 02 日
Advanced Product Change Notice (APCN) (9)
2020年4月23日
Addendum to APCN181801 - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family
2020年4月14日
Addendum to Advance PCN181801A - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family