MB9BF121LQN-G-AVE2 | サイプレス セミコンダクタ

MB9BF121LQN-G-AVE2
ステータス:販売終了

データシート

(pdf, 2.3 MB) RoHS PB Free
(pdf, 2.15 MB) RoHS PB Free
(pdf, 2.56 MB) RoHS PB Free

MB9BF121LQN-G-AVE2

ADC0
ADC Resolution12
車載用認定済みN
CPU CoreARM Cortex-M3
Cyclic Redundancy Check (CRC)?あり
DAC (Qty and Type)2xVDAC
Data Flash (KB)32
Flash Security (Read Production)?あり
Max Clock Speed (MHz)72
最大動作温度(°C)70
最大動作電圧(V)5.50
最小動作温度(°C)0
最小動作電圧(V)2.70
No. of ADC Channels23
No. of Base Timers8
No. of CAN Controllers0
No. of DMA Channels8
No. of DMA Channels (DSTC Type)0
No. of Ethernet Ports0
GPIO の数50
No. of HDMI-CEC Controllers0
No. of I2C Channels7
No. of I2S0
No. of LCD Segments0
No. of LIN Channels8
PWM チャンネル数8
No. of SPI0
No. of UART Channels8
No. of USB Ports0
Part FamilyFM3
Program Flash (KB)64
Quadrature Position/Revolution Counter (Ch.)2
RTC?あり
SD-Card Interface?N
SRAM(KB)16
Tape & ReelN
Total Flash (KB)64

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.24 $4.68 $4.21 $3.83 $3.46 $2.62
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
64
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN Suball
3A991.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技術文書

アプリケーション ノート (16)

ソフトウェアおよびドライバー (1)

2016 年 6 月 17 日

製品変更通知(PCN)(1)

2020年4月28日
Marketing Part Number Change for Select MCU and Analog Products

Advanced Product Change Notice (APCN) (2)

2020年4月14日
Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products
2020年4月14日
Planned Qualifications of Fab 25 as an Additional Wafer Fab Site and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

2020年4月14日
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020 年 3 月 25 日
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)