FM24V10-G | サイプレス セミコンダクタ
FM24V10-G
| Development Kit | N |
| 車載用認定済み | N |
| 容量（KB） | 1024 |
| 周波数（MHz） | 3.4 |
| インターフェース | I2C |
| 最大動作温度（°C） | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最大動作電圧（V) | 3.60 |
| 最小動作温度（°C） | -40 |
| Min. Operating VCCQ (V) | 2.00 |
| 最小動作電圧（V） | 2.00 |
| 組織（X x Y） | 128KB x 8 |
| Part Family | Serial FRAM |
| 速度（ナノ秒） | 0 |
| Tape & Reel | N |
| 温度分類 | 産業機器 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $12.35 | $11.05 | $9.95 | $8.78 | $8.52 | $8.19 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn
Marking
技術文書
製品変更通知（PCN）（3）
2020 年 12 月 07 日
Qualification of Greatek as an Additional Assembly Site for Select 8-Lead SOIC Package on FRAM Products
2020年4月14日
Qualification of Texas Instruments' DMOS6 as an Additional Wafer Fab Site, Cypress's Test 25 as an Additional Wafer Sort Site, OSE-Taiwan as an Additional Assembly Site for 32TSOP Package with Copper-Palladium-Gold Wire for Select 1Mb Parallel and Copper-Palladium Wire at UTAC-Thailand for Select 512Kb/1Mb Serial Industrial-Grade Products
2017 年 10 月 25 日
Standardization of Moisture Sensitive Level (MSL) Classification for F-RAM Products
Advanced Product Change Notice (APCN) (4)
Product Information Notice (PIN) (7)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to F-RAM Minimum Order Quantities, Order Increments, and Factory Order Increments to Align with Cypress Standards
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