CY9AF344MBBGL-GE1 | サイプレス セミコンダクタ
CY9AF344MBBGL-GE1
| 車載用認定済み | N |
| 最大動作温度（°C） | 70 |
| 最大動作電圧（V) | 3.63 |
| 最小動作温度（°C） | 0 |
| 最小動作電圧（V） | 1.10 |
| Part Family | FM3 |
| Part Family | FM3 |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.65 | $10.49 | $9.55 | $8.62 | $7.92 | $6.29 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
4
Peak Reflow Temp. (°C)
250 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Sn-3Ag-0.5Cu
Marking
技術文書
アプリケーション ノート (15)
製品変更通知（PCN）（2）
2020年5月28日
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
2020 年 3 月 29 日
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
Advanced Product Change Notice (APCN) (7)
2020年4月14日
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
2020年4月14日
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products
Powered By OneLink