CY9AF155MABGL-GE1 | サイプレス セミコンダクタ

CY9AF155MABGL-GE1

車載用認定済みN
最大動作温度(°C)70
最大動作電圧(V)3.63
最小動作温度(°C)0
最小動作電圧(V)1.10
Part FamilyFM3
Part FamilyFM3
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.00 $9.00 $8.20 $7.40 $6.80 $5.40
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
96
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
147
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Sn-3Ag-0.5Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技術文書

アプリケーション ノート (12)

製品変更通知(PCN)(2)

2020年5月28日
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
2020 年 3 月 29 日
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products

Advanced Product Change Notice (APCN) (6)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020年4月22日
Q220 Standard Horizon Report Update
2020年4月14日
2020 Annual Horizon Report Update
2020年4月14日
Q419 Horizon Report Update
2020年4月14日
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
2020年4月14日
Q319 Horizon Report Update

Product Information Notice (PIN) (2)

2020年4月14日
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020 年 3 月 25 日
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)