CY8C4247LQI-BL453T | サイプレス セミコンダクタ

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CY8C4247LQI-BL453T
ステータス:製造中

データシート

(pdf, 1.39 MB) RoHS PB Free

CY8C4247LQI-BL453T

車載用認定済みN
CPU CoreARM Cortex-M0
CapSenseあり
Dedicated ADC (#Max Resolution @ Sample Rate)SAR(1 個、1 msps で 12 ビット)
EEPROM (KB)0
フラッシュ(KB)128
JTAG and Si ID0x0E32119E
LCD Direct DriveN
最大動作周波数(MHz)48
最大動作温度(°C)85
最大動作電圧(V)5.50
最小動作温度(°C)-40
最小動作電圧(V)1.90
No. of CAN Controllers0
No. of Continuous Time Blocks2
No. of DMA Channels0
No. of Dedicated Comparators2
No. of Dedicated Timer/Counter/PWM Blocks4
GPIO の数36
No. of Op Amps4
No. of SIO0
No. of Serial Communication Blocks2
No. of USB IO0
No. of Universal Analog Blocks0
No. of Universal Digital Blocks4
PLLN
SRAM(KB)16
SeriesPSoC 4 BLE
SeriesPSoC 4 BLE
Tape & Reelあり
USB (Type)なし

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
営業担当者に連絡
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

パッケージ
QFN
No. of Pins
56
Package Dimensions
275 L x 1 H x 275 W (Mils)
Package Weight
94.78 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN Suball
3A991.A.2

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技術文書

アプリケーション ノート (11)

製品変更通知(PCN)(3)

2020年4月23日
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2020年4月23日
Qualification of ASE-KH as an Additional Copper Inductor Process Site for Select QFN Pb-Free Packages
2020年4月14日
Qualification of Fab 25 as an Additional Wafer Fab Site, Test 25 as an Additional Sort Site and ASE-Kaohsiung Taiwan as an Additional Assembly, Test and Finish Site for the PSoC® 4xx7 BLE and PSoC® 4xx8 BLE Product Family

Advanced Product Change Notice (APCN) (5)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020年4月22日
Q220 Standard Horizon Report Update
2020年4月14日
2020 Annual Horizon Report Update
2020年4月14日
Q419 Horizon Report Update
2020年4月14日
Q319 Horizon Report Update

Product Information Notice (PIN) (4)

2020 年 8 月 02 日
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines