CY8C20324-12LQXIT | サイプレス セミコンダクタ

CY8C20324-12LQXIT
ステータス:製造中

データシート

(pdf, 1.09 MB)

CY8C20324-12LQXIT

Development KitCY3203A-DK
車載用認定済みN
CPU CoreM8C
CapSenseあり
通信 インターフェースI2C, SPI ()
Dedicated DAC (No._ Max. Resolution @ Sample Rate)なし
フラッシュ(KB)8
LCD Direct DriveN
最大動作周波数(MHz)12
最大動作温度(°C)85
最大動作電圧(V)5.25
最小動作温度(°C)-40
最小動作電圧(V)2.40
No. of CapSense Channels1
CapSense I/O 数17
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
GPIO の数17
プログラマブル デジタル ブロックの数0
PWMSW
近接センシングN
SRAM(KB)0.5
SmartSense 有効N
Tape & Reelあり
USB (Type)なし

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.82 $1.74 $1.66 $1.59 $1.51 $1.38
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
N
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技術文書

製品変更通知(PCN)(9)

2020年4月23日
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2018 年 5 月 29 日
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
2018 年 5 月 28 日
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017 年 10 月 23 日
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
2010年4月22日
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (2)

2020年4月14日
Q419 Horizon Report Update
2020年4月14日
Q319 Horizon Report Update

Product Information Notice (PIN) (9)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 5 月 06 日
Qualification of New Carrier Tape for QFN Packages at Cypress Philippines
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels