CY7C53120E4-40AXI | サイプレス セミコンダクタ

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CY7C53120E4-40AXI
ステータス:製造中

データシート

(pdf, 539.48 KB) RoHS PB Free

CY7C53120E4-40AXI

車載用認定済みN
フラッシュ(KB)4
Max. Input Clock (MHz)40
最大動作温度(°C)85
最大動作電圧(V)5.00
最小動作温度(°C)-40
最小動作電圧(V)5.00
ROM (KB)12
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.38 $12.82 $12.26 $11.70 $11.14 $10.20
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

パッケージ
QFP
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1600
Minimum Order Quantity (MOQ)
160
Order Increment
160
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Pure Sn

技術文書

アプリケーション ノート (1)

製品変更通知(PCN)(15)

2020年5月10日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020年5月8日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020年4月14日
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018年5月28日
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
2018年5月28日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018年5月28日
Qualification of Cypress Minnesota as Alternate Wafer Fabrication Facility for Neuron® Chip Network Processor Products
2018年5月27日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018年5月27日
Shipping Label Upgrade
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018年5月27日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (2)

2018年5月27日
Advance Notification - Planned Changes to MoBL-USB TX3LP18
2018年5月27日
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Cypress Manufacturing Minnesota

Product Information Notice (PIN) (7)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement