CY7C1353G-100AXC | サイプレス セミコンダクタ
CY7C1353G-100AXC
| アーキテクチャ | NoBL、フロースルー |
| 車載用認定済み | N |
| 容量（KB） | 4096 |
| Density (Mb) | 4 |
| 周波数（MHz） | 100 |
| 最大動作温度（°C） | 70 |
| Max. Operating VCCQ (V) | 3.60 |
| 最大動作電圧（V) | 3.63 |
| 最小動作温度（°C） | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| 最小動作電圧（V） | 3.14 |
| 組織（X x Y） | 256Kb x 18 |
| Part Family | NoBL |
| Part Family | NoBL |
| Tape & Reel | N |
| 温度分類 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $9.16 | $8.17 | $7.57 | $6.98 | $6.73 | $6.44 |
Packaging/Ordering
パッケージ
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
144
Order Increment
144
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
あり
鉛フリー
あり
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材質宣言
技術文書
アプリケーション ノート (3)
製品変更通知（PCN）（13）
2020年5月10日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020年5月8日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020年4月14日
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018年5月28日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018年5月28日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018年5月27日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018年5月27日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (5)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
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