CY7C1010DV33-10ZSXI | サイプレス セミコンダクタ
CY7C1010DV33-10ZSXI
| 車載用認定済み | N |
| 容量（KB） | 2048 |
| 周波数（MHz） | なし |
| 最大動作温度（°C） | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 最大動作電圧（V) | 3.60 |
| 最小動作温度（°C） | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| 最小動作電圧（V） | 3.00 |
| 組織（X x Y） | 256K x 8 |
| Part Family | 非同期高速 SRAM |
| 速度（ナノ秒） | 10 |
| Tape & Reel | N |
| 温度分類 | 産業機器 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.73 | $3.98 | $3.55 | $3.12 | $2.95 | $2.75 |
Packaging/Ordering
パッケージ
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材質宣言
Last Update: 2020 年 2 月 07 日
技術文書
アプリケーション ノート (1)
製品変更通知（PCN）（12）
2020 年 12 月 20 日
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package
2020年5月8日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020年5月8日
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
2018年5月28日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018年5月28日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018年5月27日
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
2018年5月27日
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018年5月27日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (5)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
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