CY7C1009D-10VXI | サイプレス セミコンダクタ
CY7C1009D-10VXI
車載用認定済み | N |
容量(KB) | 1024 |
周波数(MHz) | なし |
最大動作温度(°C) | 85 |
Max. Operating VCCQ (V) | 5.50 |
最大動作電圧(V) | 5.50 |
最小動作温度(°C) | -40 |
Min. Operating VCCQ (V) | 4.50 |
最小動作電圧(V) | 4.50 |
組織(X x Y) | 128K x 8 |
Part Family | 非同期高速 SRAM |
速度(ナノ秒) | 10 |
Tape & Reel | N |
温度分類 | 産業機器 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$3.63 | $3.05 | $2.72 | $2.39 | $2.26 | $2.11 |
Packaging/Ordering
パッケージ
No. of Pins
32
Package Dimensions
825 L x 0 H x 300 W (Mils)
Package Weight
1 360.00 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1150
Minimum Order Quantity (MOQ)
345
Order Increment
345
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材質宣言
Last Update: 2020 年 8 月 03 日
技術文書
アプリケーション ノート (1)
製品変更通知(PCN)(13)
2020 年 9 月 20 日
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020 年 7 月 29 日
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020年5月8日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020年5月8日
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
2020年4月14日
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
2018年5月28日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018年5月28日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018年5月27日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (4)
2020年4月14日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (4)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products