CY7C025-35AI | サイプレス セミコンダクタ

CY7C025-35AI
ステータス:販売終了

CY7C025-35AI

車載用認定済みN
容量(KB)128
周波数(MHz)なし
最大動作温度(°C)85
Max. Operating VCCQ (V)5.50
最大動作電圧(V)5.50
最小動作温度(°C)-40
Min. Operating VCCQ (V)4.50
最小動作電圧(V)4.50
組織(X x Y)8Kb x 16
速度(ナノ秒)35
Tape & ReelN
温度分類産業機器

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$38.76 $31.98 $29.65 $27.13 $25.97 $24.81
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

パッケージ
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
N
Lead/Ball Finish
Ni/Pd/Au, Sn/Pb

技術文書

製品変更通知(PCN)(8)

2020 年 5 月 08 日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018 年 5 月 30 日
Obsolete Products List for Q3 1999
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
2018 年 5 月 27 日
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018 年 5 月 27 日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

IBIS (1)

2008 年 11 月 13 日