CY7B993V-2AXC | サイプレス セミコンダクタ
CY7B993V-2AXC
| 車載用認定済み | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 100 |
| Input Frequency Min. (MHz) | 12 |
| Input Signal Type | LVTTL, LVPECL |
| 最大動作温度（°C） | 70 |
| 最大動作電圧（V) | 3.60 |
| 最小動作温度（°C） | 0 |
| 最小動作電圧（V） | 3.00 |
| No. of Outputs | 18 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 100 |
| Output Frequency Min. (MHz) | 12 |
| Output Signal Type | LVTTL |
| Spread Spectrum | N |
| Tape & Reel | N |
| 温度分類 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $40.95 | $33.40 | $31.46 | $29.52 | $28.66 | $27.58 |
Packaging/Ordering
パッケージ
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材質宣言
Last Update: 2020 年 10 月 26 日
Last Update: 2019 年 10 月 30 日
技術文書
製品変更通知（PCN）（11）
2020年5月10日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020年5月8日
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020年4月14日
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018年5月28日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018年5月27日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (6)
Product Information Notice (PIN) (2)
2017 年 10 月 25 日
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
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