CY62167ELL-45ZXIT | サイプレス セミコンダクタ
CY62167ELL-45ZXIT
| 車載用認定済み | N |
| 最大動作温度（°C） | 85 |
| 最大動作電圧（V) | 5.50 |
| 最小動作温度（°C） | -40 |
| 最小動作電圧（V） | 4.50 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Tape & Reel | あり |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $16.50 | $13.88 | $12.38 | $10.88 | $10.28 | $9.60 |
Packaging/Ordering
パッケージ
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn
Marking
技術文書
アプリケーション ノート (2)
製品変更通知（PCN）（7）
2020年5月10日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020年5月6日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 2 月 15 日
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Product Information Notice (PIN) (8)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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