CY62147EV30LL-45BVXIT | サイプレス セミコンダクタ
CY62147EV30LL-45BVXIT
| Development Kit | なし |
| 車載用認定済み | N |
| 最大動作温度（°C） | 85 |
| 最大動作電圧（V) | 3.60 |
| 最小動作温度（°C） | -40 |
| 最小動作電圧（V） | 2.20 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Tape & Reel | あり |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $5.50 | $4.63 | $4.13 | $3.63 | $3.43 | $3.20 |
Packaging/Ordering
パッケージ
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 材質宣言
Last Update: 2020 年 6 月 03 日
Last Update: 2018 年 6 月 26 日
Package Qualification Report
Last Update: 2015 年 8 月 07 日
技術文書
アプリケーション ノート (2)
製品変更通知（PCN）（10）
2020 年 9 月 16 日
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial Grade 4Mb MoBL® SRAM Products
2020年4月14日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018年5月28日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018年5月28日
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2018年5月27日
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017 年 10 月 31 日
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (7)
2020 年 7 月 06 日
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017 年 11 月 06 日
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
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