CY25100ZXIF | サイプレス セミコンダクタ
CY25100ZXIF
| 車載用認定済み | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 166 |
| Input Frequency Min. (MHz) | 8 |
| Input Signal Type | Xtal/Ref-in CMOS |
| 最大動作温度（°C） | 85 |
| 最大動作電圧（V) | 3.45 |
| 最小動作温度（°C） | -40 |
| 最小動作電圧（V） | 3.13 |
| No. of Outputs | 2 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 200 |
| Output Frequency Min. (MHz) | 3 |
| Output Signal Type | CMOS |
| Spread Spectrum | あり |
| Tape & Reel | N |
| 温度分類 | 産業機器 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.88 | $6.62 | $5.91 | $5.19 | $4.90 | $4.58 |
Packaging/Ordering
パッケージ
No. of Pins
8
Package Dimensions
176 L x 1 H x 173 W (Mils)
Package Weight
21.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
324
Minimum Order Quantity (MOQ)
324
Order Increment
324
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 材質宣言
Last Update: 2019 年 11 月 04 日
Package Qualification Report
Last Update: 2015 年 8 月 07 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 15 日
技術文書
開発キット／ボード (1)
製品変更通知（PCN）（10）
2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018 年 5 月 28 日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018 年 5 月 28 日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the Spread Spectrum Clock Generators
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (3)
2020年4月14日
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (5)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of OSE as an additional Test and Finish Location for Cypress Products
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation