CY2308SXC-2T | サイプレス セミコンダクタ

CY2308SXC-2T
ステータス:製造中

データシート

(pdf, 569.41 KB) RoHS PB Free

CY2308SXC-2T

車載用認定済みN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
最大動作温度(°C)70
最大動作電圧(V)3.60
最小動作温度(°C)0
最小動作電圧(V)3.00
No. of Outputs8
No. of PLL1
Output Frequency Max. (MHz)133
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread SpectrumN
Tape & Reelあり
温度分類商用

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$8.62 $7.25 $6.47 $5.68 $5.37 $5.02
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

パッケージ
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2015 年 12 月 22 日

技術文書

製品変更通知(PCN)(15)

2019 年 6 月 19 日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018 年 5 月 29 日
Clarification on Product Change Notice 084713 issued on September 23,2008
2018 年 5 月 28 日
Datasheet changes to the method of specification of IDDS and Duty Cycle in the Cypress Zero Delay Buffer (ZDB) products, CY2304, CY2305, CY2309 and CY2308
2018 年 5 月 28 日
Lead (Pb)- Free Marketing Part Number Definition
2018 年 5 月 28 日
Qualification of TSMC as an alternate wafer fabrication site for the Zero Delay Buffer General Purpose Clocks Family
2018 年 5 月 27 日
Shipping Label Upgrade
2018 年 5 月 27 日
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018 年 5 月 27 日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018 年 5 月 27 日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018 年 5 月 27 日
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

2018 年 5 月 27 日
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor

Product Information Notice (PIN) (5)

2020 年 1 月 07 日
2019 年 12 月 21 日
2019 年 9 月 26 日
2017 年 11 月 06 日
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017 年 11 月 06 日
Changes to Cypress Address Labels

IBIS (1)

2010 年 5 月 27 日