CY22394FXC | サイプレス セミコンダクタ
CY22394FXC
| 車載用認定済み | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 166 |
| Input Frequency Min. (MHz) | 1 |
| Input Signal Type | Xtal/Ref-in CMOS |
| 最大動作温度（°C） | 70 |
| 最大動作電圧（V) | 3.45 |
| 最小動作温度（°C） | 0 |
| 最小動作電圧（V） | 3.13 |
| No. of Outputs | 5 |
| No. of PLL | 3 |
| Output Frequency Max. (MHz) | 400 |
| Output Frequency Min. (MHz) | 0 |
| Output Signal Type | CMOS/LVPECL |
| Spread Spectrum | N |
| Tape & Reel | N |
| 温度分類 | 商用 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $10.25 | $8.62 | $7.69 | $6.76 | $6.38 | $5.96 |
Packaging/Ordering
パッケージ
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 準拠
鉛フリー
あり
Lead/Ball Finish
Ni/Pd/Au
Marking
パッケージ材質宣言
Last Update: 2016 年 11 月 21 日
IPC 1752 材質宣言
Last Update: 2020 年 2 月 05 日
Last Update: 2020 年 2 月 05 日
技術文書
製品変更通知（PCN）（16）
2021 年 1 月 11 日
Qualification of Greatek Electronics Inc. as an Alternate Assembly Site for Select 16-Lead TSSOP Package
2020年5月10日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020年5月6日
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018年5月29日
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the CY2238x/ CY2239x, 3-PLL Clock Synthesizers
2018年5月28日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018年5月28日
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018年5月27日
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
2018年5月27日
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018年5月27日
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (4)
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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