BCM88335L2CUBGT | サイプレス セミコンダクタ

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BCM88335L2CUBGT
ステータス:製造中

BCM88335L2CUBGT

Automotive GradeAutomotive Grade 3
車載用認定済みN
Bluetooth Power ClassClass 1, Class 2
Bluetooth SpecificationBluetooth 4.1
Co-existence InterfaceIntegrated Wi-Fi and Bluetooth Coexistence, GCI SECI for external radios
Device TypeSilicon
Driver SupportLinux
FM Transceiver (TX/RX)いいえ
InterfacesSDIO 3.0/2.0, gSPI for Wi-Fi and I2C/PCM audio, HCI-over UART for Bluetooth
MIMO/SISO1x1 SISO
最大動作温度(°C)85
最大動作電圧(V)4.80
最小動作温度(°C)-40
最小動作電圧(V)3.00
Module Featuresなし
GPIO の数9
Partner ModulesN
Product FamilyBCM88335
Security and EncryptionWPA/WPA2. WAPI STA Network Security, AES encryption/decryption with TKIP and IEEE 802.1x support, Cisco Extension Support, WPS
Silicon FeaturesIntegrated PA, PMU with Buck-Mode Switching Regulator, Shared Bluetooth and Wi-Fi Antenna Support
Tape & Reelあり
Wi-Fi BandDual Band (2.4/5Ghz)
Wi-Fi PHY Data Rate (Mbps)upto 433Mbps
Wireless TechnologyWi-Fi, Bluetooth (BR + EDR + BLE)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
営業担当者に連絡
Availability Quantity Ships In サイプレスより購入 Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
145
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
5000
Minimum Order Quantity (MOQ)
5000
Order Increment
5000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
なし
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
鉛フリー
あり
Lead/Ball Finish
Sn/Ag/Cu

技術文書

アプリケーション ノート (7)

製品変更通知(PCN)(2)

2020年4月14日
Qualification of PTI-SG as an Additional Bumping, Wafer Sort, Backend and Finish Site for Select WLCSP Products
2017 年 10 月 11 日
Removal of Broadcom Logo and Transition to Cypress Part Number for Automotive IoT Products

Advanced Product Change Notice (APCN) (5)

2020年4月22日
Q220 Automotive Horizon Report Update
2020年4月22日
Q220 Standard Horizon Report Update
2020年4月14日
2020 Annual Horizon Report Update
2020年4月14日
Q319 Automotive Horizon Report Update
2020年4月14日
2019 Automotive Horizon Report: Q2 Update

Product Information Notice (PIN) (4)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020年4月14日
Wireless Products Failure Analysis Policy Change
2020 年 3 月 25 日
Acquisition of Broadcom's Internet of Things Business