You are here

パッケージ | サイプレス セミコンダクタ

パッケージ 説明 名前
SOIC 28LD (300 MIL) SOIC PACKAGE OUTLINE 51-85026
FBGA 48L FBGA 6X10X1.2mm PACKAGE OUTLINE PACKAGE OUTLINE, 48L FBGA 6X10X1.2 MM BA48B
388 PBGA PACKAGE OUTLINE 35X35X2.33mm 51-85103
BGA 576 BALL HFC-BGA PACKAGE OUTLINE 51-85211
PDIP 28 LEAD (300 MIL) PDIP PACKAGE OUTLINE 51-85014
PDIP 24 LEAD (600 MIL) PDIP PACKAGE OUTLINE 51-85016
PBGA 119-PBGA 14X22MM NON PB-FREE PMDD 119-PBGA 14X22MM NON PB-FREE PMDD
LCC 44LD WINDOWED SQUARE LCC PACKAGE OUTLINE 51-80104
VFBGA 48L VFBGA 6X10X1.0 MM BV48C PACKAGE OUTLINE 51-85182
TQFP 48LD TQFP (7 X 7 X 1.0MM) PACKAGE OUTLINE 51-85166
JLCC 84LD JLCC PACKAGE OUTLINE 001-05462
VFBGA 54 VFBGA (8 X 8 X 1.0MM) PACKAGE OUTLINE 51-85177
LCC 6L RECTANGULAR LCC 7.0X5.0X1.8 MM L06RA (RESONATOR) 51-80110
FBGA 529 FBGA PACKAGE OUTLINE (25 X 25 X 1.9MM) 51-85200
VFBGA 36 - VFBGA (6 X 8mm) Non Pb-Free Package Material Declaration Datasheet
TSSOP 48LD SSOP 300 MILS O483PACKAGE OUTLINE 51-85061
BGA 304 CSBGA (31 X 31 X 1.7MM) PACKAGE OUTLINE 51-85205
388 HSBGA PACKAGE OUTLINE 35X35X2.33mm 51-85102
LCC 48 WINDOWED PLASTIC LCC PACKAGE OUTLINE 001-00453
PDIP 32 LEAD (400 MIL) PDIP PACKAGE OUTLINE 51-85044

Pages