You are here

パッケージ | サイプレス セミコンダクタ

パッケージ 説明 名前
IPC1752 MATERIAL DECLARATION FBGA24 (6x8x1.2 mm) (FAB024)_BKK_CuPd WIRE_SnAgCu(SAC305)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752_MATERIAL_DECLARATION_SOIC16_(300_mil)_(SZ16)_CML_CuPdAu_WIRE_NiPdAu_HENKEL_QMI509_KYOCERA_KEG3000
IPC1752 MATERIAL DECLARATION FBGA48 (6X8X1 MM) (BZ48)_ASEK_AU WIRE_SNAGCU(SAC305)_HENKEL 2100A_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION_QFN48 (6.0X6.0X0.6 mm)(LQ48)_ASEK_CuPdAu Wire_PURE Sn_FURUKAWA NEX-130CTX AND SUMITOMO CRM-1191A_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION SOJ36 (400 MIL) GREATEK_CUPDAU WIRE_MATTE TIN_HITACHI EN-4900GC_SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION SSOP56 (300 MIL) _GREATEK_CUPDAU WIRE_MATTE TIN_HITACHI EN-4900GC_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION SOJ32 (300 MIL) _GREATEK_CUPDAU WIRE_MATTE TIN_HITACHI EN-4900GC_SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION SOJ32 (400 MIL) _GREATEK_CUPDAU WIRE_MATTE TIN_HITACHI EN-4900GC_SUMITOMO G700SLA
IPC 1752 MATERIAL DECLARATION 32L TSOPII (ZW32A)_UNIMOS SHANGHAI_CUPDAU WIRE_MATTE TIN_HITACHI EN-4900F_HITACHI_CEL9200HF-U
IPC1752 MATERIAL DECLARATION 48 LEAD TSOP FRAME 2.50MM DIA. DAP MATRIX_BKK_CuPdAu WIRE_HENKEL PASTE ABLESTIK 8340_HITACHI CEL9200HF10
IPC1752 MATERIAL DECLARATION TQFP44 (10X10X1.4mm) (AZ44)_ASEK_CuPd WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EME-G631
TEST REPORT SENJU METAL SOLDER PASTE SAC305 M705-BPS7 SERIES ROHS AND HALOGEN
TEST REPORT PAN CONTINENTAL COPPER OXIDE ROHS AND HALOGEN
IPC 1752 MATERIAL DECLARATION_ LQFP64 (10 X 10 X1.7 MM) (LQD064)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_ LQFP80 (12 X 12 X1.7 MM) (LQH080)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_ LQFP100 (14 X 14 X1.7 MM) (LQI100)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_ LQFP144 (20 X 20 X1.7 MM) (LQS144)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_ LQFP176 (24 X 24 X1.7 MM) (LQP176)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_ TEQFP176 (24 X 24 X1.7 MM) (LEE176)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_ SUMITOMO G631H
IPC 1752 MATERIAL DECLARATION_BGA 124 (9X9X1.0MM)_BZ124_BKK_AU WIRE
IPC1752 MATERIAL DECLARATION Ex-LQFP144 (20X20X1.7 mm) (LEX144)_ATJ_CuPdAu WIRE_Sn_HITACHI EN4600B_SUMITOMO EMEG700X
IPC1752 MATERIAL DECLARATION LQFP64 (12X12X1.7 mm) (LQG064)_ATJ_CuPdAu WIRE_SnBi_HENKEL 8361F_SUMITOMO EMEG660B
IPC1752 MATERIAL DECLARATION LQFP64 (12X12X1.7 mm) (LQG064)_ATJ_CuPdAu WIRE_Sn_HENKEL 8361F_SUMITOMO EMEG660B
IPC1752 MATERIAL DECLARATION TDFN 8L (4X4.5X0.8 mm) (LH08)_UTAC THAILAND_CuPdAu_PURE Sn_HENKEL 8200T_SUMITOMO G770HCD
IPC1752 MATERIAL DECLARATION QFN40 (6X6X0.6MM) (LQ40)_ASEK_CuPdAu_PURE Sn_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION FBGA48 (8.15 X 6.16 mm mm) (VBK048)_BKK_CuPd WIRE_SnAgCu(SAC305)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION QFP100 (14X20X2.75 mm) (PQH100)_ATJ_Au WIRE_Sn_HITACHI EN4600B_SUMITOMO XJ2
IPC1752 MATERIAL DECLARATION FBGA64 (LSH064)_BKK_CuPdAu WIRE_SnAgCu(SAC305)_HENKEL QMI546_HITACHI FH-4026T_SHINETSU KMC 3580LVA
IPC1752 MATERIAL DECLARATION WLCSP153 (2.87X4.87X0.33MM)(FL0AB) PTI SINGAPORE_SNAG(SAG1.8)
IPC1752_MATERIAL DECLARATION WLCSP42 (3.01X2.50X0.60 MM)(FN42C) PTI SINGAPORE_SNAGBICU(SAC0307Bi)
IPC1752 MATERIAL DECLARATION TSSOP20 (4.4 mml) (ZZ20)_GREATEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION QFN56 (7X7X0.6 MM) (LQ56)_CML_CUPDAU WIRE_NIPDAU_HENKEL QMI519_SUMITOMO G700Y
IPC 1752 MATERIAL DECLARATION_Ex-LQFP208 (28 X 28 X 1.7 mm) (LER208)_J-Devices-Fukuoka_CuPdAu wire_Sn_EN4600B_G660B
IPC1752 MATERIAL DECLARATION_FBGA48 (8X9.5X1.4 MM) (BK48L)_ASEK_CUPDAU WIRE_SAC305_ABLESTIK ATB-125_KYOCERA KE-G1250AAS
IPC1752 MATERIAL DECLARATION_TQFP 100 (14X14X1.4MM) (AZ100)_CML_CuPdAu WIRE_NiPdAu_HENKEL QMI509_KYOCERA KEG3000DA
IPC1752 MATERIAL DECLARATION TSSOP20 (4.4 mml) (ZZ20)_GREATEK_Au WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION SOIC8 (5.28x5.28x2.16 mm) (SOC008)_ZKT_Au WIRE_PURE Sn_SAMSUNG SG8300HKT_NITTO EM310
IPC1752 MATERIAL DECLARATION SOIC8 (5.28x5.28x2.16 mm) (SOC008)_ZKT_CuPd WIRE_PURE Sn_SAMSUNG SG8300HKT_NITTO EM310
IPC1752 MATERIAL DECLARATION QFN56 (7X7X1.0 mm) (LT56D)_ASEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION SOIC 8 (5.28X5.28X2.16 mm) (SOC008) - GREATEK - CUPDAu WIRE - MATTE TIN - HITACHI EN-4900GC - SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION_WLBGA194 (5.2X7.7X0.55MM) (FN0AS)_ASEK_SNAGCUBI(SAC405)
IPC1752 MATERIAL DECLARATION QFN24 (4.0X4.0 mm) (LQ24)_ASEK_CuPd WIRE_PURE Sn_HITACHI FH-900_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION QFN56 (7X7X0.9 mm) (LT56C)_ASEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION SOIC8 (3.9X4.9X1.6 mm) (SOA008)_GREATEK_Au WIRE_PURE Sn_HITACHI EN4900GC_SUMITOMO G700HA
IPC1752_MATERIAL DECLARATION WLCSP69 (4.53X2.93X0.55 MM)(FN69A) PTI SINGAPORE_SNAGBICU(SAC0307Bi)
IPC1752_MATERIAL DECLARATION WLCSP145 (4.87X5.413X0.55 MM)(FN0AG) PTI SINGAPORE_SNAGBICU
IPC1752_MATERIAL DECLARATION WLCSP133 (4.89X5.33X0.55 MM)(FN0AB) PTI SINGAPORE_SNAGBICU
IPC 1752 Material Declaration_ FBGA81(8.0 X 8.0 mm) (BK81A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HITACHI HR5104_SHINETSU KMC3580LVA
IPC 1752 Material Declaration_ FBGA64 (7.0 X 7.0 mm) (BK64A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC 1752 Material Declaration_ FBGA50 (4.5 X 4.0 mm) (BZ50A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HITACHI HR5104_SHINETSU KMC3580LVA

Pages