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Robust System Thermal Management | サイプレス セミコンダクタ

Robust System Thermal Management


Today, process technology has advanced to 32nm, resulting in an increase in the number of transistors per unit area and a reduction in package size. At the same time, system designers are trying their best to reduce the system size by increasing the component density on boards, adding as many features in the design as possible to deliver the industries’ best products in terms of space and size.