PCN074597 | サイプレス セミコンダクタ
PCN074597
最終更新日:
2018年5月28日
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages
Assembled at AIT
Issue Date: 22-Dec-07
Effectivity Date: 01-Apr-08
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages
Assembled at AIT
Issue Date: 22-Dec-07
Effectivity Date: 01-Apr-08