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PCN074591 | サイプレス セミコンダクタ

PCN074591

最終更新日: 
2018年5月28日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls

Issue Date: 17-Dec-07
Effectivity Date: 01-Mar-08