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PCN071530 | サイプレス セミコンダクタ

PCN071530

最終更新日: 
2018年5月28日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls

Issue Date: 20-Jul-07
Effectivity Date: 01-Oct-07