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PCN071439 | サイプレス セミコンダクタ

PCN071439

最終更新日: 
2018 年 5 月 27 日

Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish

Issue Date: 28-Mar-07
Effectivity Date: 01-Jun-07