PCN050667 | サイプレス セミコンダクタ
PCN050667
最終更新日:
2018年5月27日
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Issue Date: 30-Jun-2005
Effectivity Date: sep-2005
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Issue Date: 30-Jun-2005
Effectivity Date: sep-2005