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BCM2073XS SiP Module: BCM20737L - Bluetooth Low Energy System in Package (SiP) Module | サイプレス セミコンダクタ

BCM2073XS SiP Module: BCM20737L - Bluetooth Low Energy System in Package (SiP) Module

2020 年 6 月 03 日

The Cypress CYW20737L is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The device includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so a minimal set of external components is needed to create a standalone BLE device. The CYW20737L accelerates time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20737L includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. Coupled with an ultrasmall form factor and support for a wide voltage range, the CYW20737L is ideal for any BT Smart application.

Dear valued customer,

Thank you for choosing our products. They come with all the know-how and passion that our engineers have put into it. As you probably already know, Cypress is now Infineon. This is a major step for our company, but also for the good of you. 

Reliability and business continuity are of utmost importance for us. Hence, we remain fully committed to honoring existing customer and distributor relationships. This includes offering the legacy Cypress product portfolio. We thank you very much for your trusting support.

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