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AN98554 - Cypress, Micron, and Winbond High Density 3.0 Volt SPI Flash Core Command Sets | サイプレス セミコンダクタ

AN98554 - Cypress, Micron, and Winbond High Density 3.0 Volt SPI Flash Core Command Sets

最終更新日: 
2020年5月29日
バージョン: 
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AN98554 discusses the differences of the core command sets Cypress’s high-density, 3.0-V SPI flash devices with 128 Mbit or higher densities with devices from Micron and Winbond.

Dear valued customer,

Thank you for choosing our products. They come with all the know-how and passion that our engineers have put into it. As you probably already know, Cypress is now Infineon. This is a major step for our company, but also for the good of you. 

Reliability and business continuity are of utmost importance for us. Hence, we remain fully committed to honoring existing customer and distributor relationships. This includes offering the legacy Cypress product portfolio. We thank you very much for your trusting support.

For the full version of this message, please download the PDF version.