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AN69061 - Design, Manufacturing, and Handling Guidelines for Cypress Wafer Level Chip Scale Packages | サイプレス セミコンダクタ

AN69061 - Design, Manufacturing, and Handling Guidelines for Cypress Wafer Level Chip Scale Packages

最終更新日: 
2017年4月27日
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AN69061 provides guidelines for the design, manufacture, and handling of Cypress wafer level chip scale packages on flexible printed circuits and rigid printed circuit boards.

はじめに

This application note is for engineers who design and develop surface mount technology (SMT), printed circuit boards (PCB), or flexible printed circuits (FPC) for wafer level chip-scale package (WLCSP) devices.