You are here

AN17006 - High Speed Serial Simulation with HOTLink II™ | サイプレス セミコンダクタ

AN17006 - High Speed Serial Simulation with HOTLink II™

最終更新日: 
2017 年 7 月 20 日
バージョン: 
*C
AN17006 discusses the methodology for simulation of high speed links of the HOTLink II™ over the backplanes, using H-Spice.

HOTLink II™ Background

 
The HOTLink II™ family of devices are point-to-point or point-to-multipoint communication building blocks, providing encoding, serialization, deserialization, and decoding at high speed and are compatible with many communication standards. A HOTLink II device is a frequency agile transceiver with the ability of the serial links to transport data at a rate between 0.2 and 1.5 Gigabits per second (Gbps) per channel.

Dear valued customer,

Thank you for choosing our products. They come with all the know-how and passion that our engineers have put into it. As you probably already know, Cypress is now Infineon. This is a major step for our company, but also for the good of you. 

Reliability and business continuity are of utmost importance for us. Hence, we remain fully committed to honoring existing customer and distributor relationships. This includes offering the legacy Cypress product portfolio. We thank you very much for your trusting support.

For the full version of this message, please download the PDF version.